產品分類 : 積體電路(IC)無線和射頻積體電路RF 功率分配器/分離器
產品數量: 272
描述:IC DIVIDER PROGR LO NOISE 16-QFN
封裝/規格:16-VFQFN Exposed Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC RF SPLITTER ACTIVE 12-LFCSP
封裝/規格:12-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:SPLITTER/COMBINER 2.2-2.8GHZ
封裝/規格:6-WFDFN Exposed Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:MLO RF-RF CROSSOVER SMD
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:MLO RF-DC CROSSOVER SMD
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC POWER DIVIDER RF 0805
封裝/規格:0805 (2012 Metric), 6 PC Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC POWER DIVIDER RF 0805
封裝/規格:0805 (2012 Metric), 6 PC Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC POWER DIVIDER RF 0805
封裝/規格:0805 (2012 Metric), 6 PC Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC POWER DIVIDER RF 0805
封裝/規格:0805 (2012 Metric), 6 PC Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC POWER DIVIDER RF 0805
封裝/規格:0805 (2012 Metric), 6 PC Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:0603 CROSSOVER 0-6000MHZ
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:RF POWER DIVIDER 2.45 GHZ 0603
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:CHIP POWER SPLITTER 0805 SIZE, 0
庫存數量:1 +
10 +
100 +
500 +
>=1000